Silitronics offers value added package design and assembly services from concept to NPI to high volume production. We are committed to help our customers with their entire package development as a turnkey project or assist in any of the design stages such as netlist creation, layout, SI/PI and thermal analysis including fabrication of the build up multi-layer HDI and Ceramic boards.
One of our key differentiated services is assembly process development. Many of the NPI package assemblies which Silitronics does are so advanced that there is no precedence and does not fit in a standard assembly template. Often the design rules have to be pushed beyond their limits. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well crafted Design of Experiments (DOE) and even investments in new equipment. Silitronics has 100+ man years of R&D experience, in this assembly process development, to take NPI packages to high volume production.
Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop, and implement cost effective packaging solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in San Jose, the heart of Silicon Valley, and boasts a 10,000+ sq.ft. state of art automated facility with 10K and 1K clean rooms.
Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. In house Machine Shop for fast cycle time.
“SUB2r had an aggressive time line that would take a highly complex technology from white board to production prototypes in the 110 days we had leading up to NAB Las Vegas 2021. This means that every partner in the process had to run at an accelerated pace. The project consists of 3 boards. On the first 2, Silitronics came in under the schedule – putting us slightly ahead of schedule. Their attention to details and quality of their work is exceptional.
We are beginning work on the main motherboard and our expectation is Silitronics will again beat the schedule. When the success of your company is based on a very critical execution of every piece, where everything must work the first time, you need to have a partner like Silitronics who you can be confident that they will perform.
At SUB2r we make a clear distinction between a vendor/supplier and a partner. Only a partner is invested in your success. As we ramp up, Silitronics will continue to our partner for NPI builds and High Volume as well.”
“Very pleased with your services and have (will) recommend it to anyone. Good businesses such as Silitronics deserve appreciation.
A slew of innovation in semiconductor packaging technologies is often required to address performance slack left by the slow down in Moore’s law. Silitronics is at this forefront offering innovative package design and assembly solutions serving in the areas of Silicon photonics, LiDAR, Quantum computing, AR/VR, Aerospace, Autonomous driving, IOT and Cloud Data Centers. For the leading edge designs in these areas, we do the path finding on behalf of our customers to arrive at a high volume manufacturable solution. We constantly experiment with new ideas and materials, fine tune assembly steps, acquire new equipment and push boundaries of the design rules.
Furthermore, we work with fabs in US on their cutting edge technologies in ceramic, build-up organic, any layer HDI PCB, silicon interposer and glass substrates. Above all, we take pride in providing best in class innovative package design and assembly solutions for our customers.
We work with the customers all the way from path finding to prototype R&D builds to low volume NPI builds to high volume. We also help our customers with NPI product qualifications and ramp up production up to 6 million units year. In addition, we can help customer with initial supply chain related activities such as selection of high volume partners, negotiate the best price, yield enhancement, ramp up, assembly tooling and process transfer, etc. Silitronics team has extensive supply chain experience including 20M sensors/month, $75M JV to set 12,000 wafer/month WLCSP line, $100M/year in Assembly and Test. Startup customers normally does not have supply chain folks initial so Silitronics can definitely help during the initial phase of engagement at a nominal cost. Following are some examples of NPI build capabilities