Our Services
Design, Process Development and Assembly

Silitronics offers value added package design and assembly services from concept to NPI to high volume production. We are committed to help our customers with their entire package development as a turnkey project or assist in any of the design stages such as netlist creation, layout, SI/PI and thermal analysis including fabrication of the build up multi-layer HDI and Ceramic boards.

One of our key differentiated services is assembly process development. Many of the NPI package assemblies which Silitronics does are so advanced that there is no precedence and does not fit in a standard assembly template. Often the design rules have to be pushed beyond their limits. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well crafted Design of Experiments (DOE) and even investments in new equipment. Silitronics has 100+ man years of R&D experience, in this assembly process development, to take NPI packages to high volume production.

Customer Applications

Silitronics works closely with customers to understand their product requirements, suggest alternatives in package/SiP design or optimize process development or suitable assembly flow for the application. Typical engagements will cover following areas:
Starting with netlist and product specifications, develop 2.5D and 3D SiP solutions for Chiplet Integration and New Product Introduction
Optimize package selection for the best performance, price and schedule. Evaluate Test and Reliability Plan to optimize BOM
Package layout followed by in depth SI, PI and Thermal/Mechanical analysis. Design for Assembly analysis to ensure high yield, quality and competitive pricing
Silitronics is equipped with state of the art Assembly Equipment enabling packaging for many end applications

Facility

Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop, and implement cost effective packaging solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in San Jose, the heart of Silicon Valley, and boasts a 10,000+ sq.ft. state of art automated facility with 10K and 1K clean rooms.

Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. In house Machine Shop for fast cycle time.

Typical Cycle Time

Examples of Selected SiP Assemblies

Silitronics team has expertise and hands on experience to propose, develop and implement cost effective solutions within schedule. Silitronics is centrally located in Silicon Valley, San Jose, CA in a 10,000+ square feet facility with Clean Room 10K and 1K.

"We are greatly appreciative of Silitronics’ demonstrated support during Kncade Wildfires and assuring supply during COVID global pandemic constraints "

- Leading 5G customer

Made in USA

Silitronics is centrally located in San Jose, CA, the heart of the Silicon Valley, with Assembly, R&D, and Cleanroom facilities. We can support your advanced custom assembly, process development and design needs without risks of going overseas for your complex and confidential projects. Additionally, by being local we can support faster turn around times, enabling you to get to the market rapidly.

Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop and implement cost effective solutions from concepts to finished products within schedule while exceeding specifications. Silitronics boasts a state of art automated assembly facility with 10K and 1K clean rooms.

First Time Right

Customer success is our success! We want our customers not only be successful but more importantly Right First Time which enables them faster time to market. Silitronics Team has a collective experience of 100+ man years in design and assembly technologies, have addressed complex challenges and achieved First Time Right. We also invested in state of art Equipment, Tools and Software to assure quality, repeatability and successes. Quality is our top priority and constantly improve our processes to be the best in the industry. Quality certifications we earned include ISO9001, ISO13485, MILSTD883, MILSTD38534 and ITAR

Customer Testimonials

Leading LiDAR Automotive Customer

“Please convey our sincere thanks and appreciation to your management and staff for the quality services you have rendered. We would like to acknowledge your timely deliveries and attention to detail. These characteristics of your team have enabled our rapid development of highly technical and challenging SiP assemblies. Thanks to your team of professional, we have produced a number of first-run SiP LiDAR assemblies which have performed with 100% functionality. We still have many new projects which will require the same level of technical insight and error free execution you have achieved in the last 18 months of our association. We look forward to a mutually beneficial business relationship in the coming months, and we commend you as one of our top SiP assembly suppliers.”

Richard Neumann – Co-Founder / CEO SUB2r

New Camera Debut, 4K, Live Streaming, Gaming

“SUB2r had an aggressive time line that would take a highly complex technology from white board to production prototypes in the 110 days we had leading up to NAB Las Vegas 2021. This means that every partner in the process had to run at an accelerated pace. The project consists of 3 boards. On the first 2, Silitronics came in under the schedule – putting us slightly ahead of schedule. Their attention to details and quality of their work is exceptional.

We are beginning work on the main motherboard and our expectation is Silitronics will again beat the schedule. When the success of your company is based on a very critical execution of every piece, where everything must work the first time, you need to have a partner like Silitronics who you can be confident that they will perform.

At SUB2r we make a clear distinction between a vendor/supplier and a partner. Only a partner is invested in your success. As we ramp up, Silitronics will continue to our partner for NPI builds and High Volume as well.”

Leading Defense Space Customer

“Very pleased with your services and have (will) recommend it to anyone. Good businesses such as Silitronics deserve appreciation.

  • a- On Time Delivery: Always on time, most of the time ahead of the promised date.
  • b- Quality: Excellent, their services (SMT PCBA, Wire Bonding, Die Attach, Flip-Chip, Handling 50um thin MMIC die, etc.) is clearly outstanding. Never had any issue. They own their work and will make sure that the job is done exactly how it was planned.
  • c- Communication: Fantastic. Always reply within 48 hours. Most of the time the same day and within a few hours. Communicate issues quickly, and not hesitant to ask questions if something is not clear. They also communicate any technical challenges and possible solutions clearly and in a timely manner.
  • d- Overall: Silitronics is interested in the customer’s project. They usually provides valuable feedback and try their best to have the optimal solution. Finally, their staff are brilliant with great attitude, customer friendly, and knowledgeable.”

Leading 5G and RF Product Customer

“We are greatly appreciative of Silitronics’ demonstrated support during Kncade Wildfires and assuring supply during COVID global pandemic constraints. Silitronics responds, within 24 hours, to all inquiries in a complete and timely manner. For last one year, almost all lots were conforming to 95% Vendor Yield and 955+ Incoming Inspection Yield, only exception was a lot slightly under 95% (94.5%). We value our long-term relationship and on-going support of our complex IC Package requirements from Silitronics. Your skill at assembling a wide variety of complex parts has made our job easier and contributed to our success. You have been very flexible and responsive to our needs and your team is enjoyable to work with. We are looking forward to expanding this fruitful relationship.”

Leading Medical and MEMS Sensors Customer

“Outstanding support in new product development. Thanks for meeting and exceeding development time targets”

Leading FinTech Computing Customer

“The Flip Chip SiP board is fully proven. We are ready to build the remaining lot…………Well done! You won the race again……….. Yes, this production was clearly a success!!!.................. Dhiraj: I love the work you and your team did. You won the race by a large margin. The best way I can say thanks it to propose we do it again with another chip + another design + full turn key assembly. Please join me……Once again, you were the first to deliver. Well done."

Innovative Solution

A slew of innovation in semiconductor packaging technologies is often required to address performance slack left by the slow down in Moore’s law. Silitronics is at this forefront offering innovative package design and assembly solutions serving in the areas of Silicon photonics, LiDAR, Quantum computing, AR/VR, Aerospace, Autonomous driving, IOT and Cloud Data Centers. For the leading edge designs in these areas, we do the path finding on behalf of our customers to arrive at a high volume manufacturable solution. We constantly experiment with new ideas and materials, fine tune assembly steps, acquire new equipment and push boundaries of the design rules.

Furthermore, we work with fabs in US on their cutting edge technologies in ceramic, build-up organic, any layer HDI PCB, silicon interposer and glass substrates. Above all, we take pride in providing best in class innovative package design and assembly solutions for our customers.

Some of our advanced capabilities include

Large array gold stud bumping (< 20um height, < 40um pitch)
Multi level high dense wire bonding (5+ tiers, 4K+ wires per SiP module)
Micro-bump assemblies (< 20um pitch)
Fine pitch Cu pillar assemblies (< 80 um pitch)
Thermo-compression / Thermo-sonic flip chip assemblies with +/- 0.5um alignment
MMIC RF SIPs (100 um thin dies with active air bridge, < 50 um loop height, < 250 um length)
Large array high density VCSEL (< 100um x 100um) assembly on glass substrates
Multi chiplets assembly with silicon interposer (8+ dies, 1.2K+ bumps, 1K+ wire bonds)
Fiber array attachment to silicon photonic ICs
Die to Wafer flip-chip assembly (8” wafer)
Die to die flip-chip bonding
Die assemblies with extra large aspect ratio (4” in length)

Prototype to Volume

We work with the customers all the way from path finding to prototype R&D builds to low volume NPI builds to high volume. We also help our customers with NPI product qualifications and ramp up production up to 6 million units year. In addition, we can help customer with initial supply chain related activities such as selection of high volume partners, negotiate the best price, yield enhancement, ramp up, assembly tooling and process transfer, etc. Silitronics team has extensive supply chain experience including 20M sensors/month, $75M JV to set 12,000 wafer/month WLCSP line, $100M/year in Assembly and Test. Startup customers normally does not have supply chain folks initial so Silitronics can definitely help during the initial phase of engagement at a nominal cost. Following are some examples of NPI build capabilities


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