Your trusted one-stop
partner for advanced
semiconductor and
photonics packaging.

Pushing the boundaries of design,
fabrication, and assembly while
driving sustainability.

Get in touch

Powering the
high-speed data
revolution with
photonics

Delivering precision optical
alignment that ensures low-latency,
high-bandwidth solutions for AI,
HPC, and 6G networks.

Get in touch

Engineering the
foundation of next-gen
semiconductor
packaging.

Pioneering high-precision design and advanced substrate fabrication to power AI, HPC, 5G, and next-gen computing with unmatched reliability.

Get in touch

ENABLING LIDAR EVOLUTION
WITH MULTI-CHIPLET
SIP PACKAGING.

Advanced heterogeneous integration
and high-precision SiP solutions
optimizing performance, scalability,
and efficiency for next-gen ADAS.

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ONSHORE WAFER
PROCESSING.

Wafer thinning, polishing and
dicing (including stealth laser)
of upto 12 inch diameter.

Get in touch

BUILD-UP SUBSTRATE
FABRICATION.

Advanced flipchip substrate 70x70,
6-2-6,12 micron line space.

Get in touch

Your trusted one-stop partner for advanced semiconductor and photonics packaging.

Pushing the boundaries of design, fabrication, and assembly while driving sustainability.

Get in touch

Powering the high-speed data revolution with photonics

Delivering precision optical alignment that ensures low-latency, high-bandwidth solutions for AI, HPC, and 6G networks.

Get in touch

Engineering the foundation of next-gen semiconductor packaging.

Pioneering high-precision design and advanced substrate fabrication to power AI, HPC, 5G, and next-gen computing with unmatched reliability.

Get in touch

Enabling lidar evolution with multi-chiplet sip packaging

Advanced heterogeneous integration and high-precision SiP solutions optimizing performance scalability, and efficiency for next-gen ADAS.

Get in touch

ONSHORE WAFER PROCESSING.

Wafer thinning, polishing and dicing (including stealth laser) of upto 12 inch diameter.

Get in touch

BUILD-UP SUBSTRATE FABRICATION.

Advanced flipchip substrate 70x70, 6-2-6,12 micron line space.

Get in touch

Build With The Best

The Silitronics team brings 100+ years of collective expertise in architecting designing, developing, and executing cost-effective, high-precision semiconductors and photonics packaging solutions—from initial concept to full-scale production.

Silitronics is a state-of-the-art, 20,000 sq ft automated ISO 9001 facility in San Jose, the heart of Silicon Valley, we ensure complicated process development including automated photonics active alignment, seamless scalability, and quality, consistently meeting the most demanding schedules and exceeding performance expectations.

Made in USA

Complete Turnkey Solutions

First Time Right

Prototype to Volume

Made in USA

Complete Turnkey Solutions

First Time Right

Prototype to Volume

Your Trusted One-Stop Partner For Advanced Semiconductors and Photonics Packaging

Our Solutions Spectrum

Early Packaging Architecture
Exploration and Feasibility Analysis

With our advanced engineering and manufacturing expertise, we can
engage with you at the earliest stages of product definition ,
review the product architecture together, with a path to volume
production.

Comprehensive
PRD Development

Package
architecture Review

Cost, yield, quality
and Scalability Considerations

Rapid Prototyping and Turnkey Designs

We have in-house expertise to assist in all aspects of your
product development, from rapid prototyping to turnkey
solutions across many industries and applications.

Heterogeneous
Integration

Silicon
Photonics

MLO/mSAP/SLP/HDI

Test and
Characterization boards

Embedded systems

Engineering Evaluation and Review
for DFM, DFA & DFQ

Silitronics utilizes state of the art CAD tools to design next
generation packaging and silicon photonics solutions. We specialize
in Multiphysics analysis to ensure your products meet all of the SOW
requirements and is optimized for first-pass success.

Zemax
modeling

SI/PI & Thermal
Simulation

Chip-Package-
PCB Co-Design

High-Speed Layout &
Stack-up Optimization

Substrate Design and Fabrication
after DFM

We can fabricate build-up MLO substrates, mSAP/SLP, HDI boards, both,
in house and through our extensive partner network for volume.

Multi-layer Organic
& Ceramic Substrate

High speed low
loss materials

Thin core

Micro-via & Fine-Pitch
Interconnect Processing

Embedded capacitors

Comprehensive IC + PIC
Assembly capabilities

At Silitronics, we have decades of experience assembling complex
packaging solutions.

1x24 FAU
attachment

+/- 0.5um Active
alignment

Flip-Chip &
Wire Bonding

3D IC Stacking &
SiP Integration

Embedded capacitors

Custom Process Development for Complex IC + PIC Packaging

Silitronics specializes in developing custom semiconductor and photonic packaging processes tailored for multi-chiplet SiP, heterogeneous integration, and ultra-high-speed interconnects.

Sub-Micron
Active Alignment

FAU Design
& Selection

Co-packaged
Optics (CPO)

Tested for Perfection,
Engineered for Reliability

Reliability isn’t an afterthought—it’s engineered
into every package at Silitronics. Our comprehensive
testing protocols ensure that each semiconductor and
photonic package meets performance, durability, and
efficiency benchmarks before deployment.

Electrical
Testing

Optical
Validation

Thermal &
Stress Testing

Mil Std 883
Rel Testing