Silitronics co-designs and co-assembles SiP products, as per customer’s specifications, which requires extreme miniaturization, cost reduction, continuous performance enhancements, power reduction, minimize latency, reduce noise level and new innovations!!!
Focus: High Mix, Low Volume, Vertically Integrated Turnkey Solutions to meet customer's design and schedule
Customers: Start-up to Fortune 500 across North America in Silicon Photonics, LiDAR, Telecom, Industrial, Wireless, IoT Sensors, Medical and Defense Markets
To provide the best vertically integrated design and manufacturing services, Silitronics co-works with customer to understand their product specification and then provide assessment. Silitronics has the domain knowledge, experience and resources to handle all challenges. Silitronics provides the best possible prototype and product the first time.
To provide full turn-key solutions!!!
Fast Turn Around to meet Customer’s Schedule!!!
100+ years of Domain Experience by Silitronics Team!!!
Silitronics has been providing microelectronics packaging and assembly development services in Silicon Valley, California for last thirty years. All engineering processes, from prototype to mid-volume productions, are performed in a modern automated Clean Room facility. All Silitronics associates are fully trained in every assembly process; and committed to provide quality products and services on committed schedule. All customer WIPs are stored in ESD safe nitrogen dry boxes.
Silitronics specializes in providing vertically integrated solutions for sophisticated and unique microelectronics packaging requirements in: Silicon Photonics, Chip on Board Packages for Medical, Defense, IoT Sensors, Telecom, Driverless Car and Commercial applications.
Silitronics has built a solid reputation for quality, craftsmanship and expertise in providing the most advanced and innovative packaging solutions.
Silitronics co-develop and co-work with customers to develop their next generation products. Silitronics team has over 100+ years of domain experience to expedite customer’s product development and time to market with 1st time success!!!
The applications in LiDAR, Silicon Photonics, 400G Telecom, 40GHz+ RF Wireless, Cloud Computing, Innovative X-ray, Carbon Sensors and others have created a new era of printed circuit board (PCB) design transformation to system in package (SiP) design methodology. The need for SiP solutions has driven the entire semiconductor, packaging, design chain and supply chain industries to develop advanced technologies that can address the increasing needs for cost reduction, size reduction and performance enhancements for advanced electronic systems.
The transition to SiP design requires new thinking, new approaches and solid understand of assembly for electronic circuit designs, components integration and final testing as well as functional verifications. PCB design is based on horizontal component placement with sufficient distance to minimize electromagnetic coupling among passive components, pre-packaged Integrated Circuits, highly capacitive interconnect structures, and relatively easy to modify and enhance circuits. However, SiP designs are primarily based on vertical component placement, bare dice, and low capacitive interconnect structures to reduce power consumption. To address these challenges, Silitronics team provide value add engineering services by using their 100+ years of domain experience and 10+ patents in semiconductor assembly.
Silitronics assembles SiP Modules for Silicon Photonics, IoT, Carbon Sensors, LiDAR, Bio-Medical, Networking and Defense applications!
Silitronics has built a solid reputation for quality, craftsmanship and expertise in providing the most advanced and innovative packaging solutions. Silitronics is ideally located in Silicon Valley, CA in a 10,000+ square feet facility. Silitronics has the capability to be the fastest time-to-market for your prototype or small-to-medium volume production run. Silitronics team has attention to detail in their professionalism and expertise throughout the production process.
Silitronics earned its reputation by producing the most advanced circuits and maintaining an ongoing commitment to quality. The entire Silitronics team demonstrates this commitment with their professionalism and expertise throughout the production process. Silitronics has the fastest time-to-market cycle time for your prototype or small-to-medium volume production.
Silitronics team is committed to:
Silitronics prides itself on having built a company comprised of experts from many disciplines, including substrate designers, process and packaging development engineers. Our team members have diverse backgrounds that range from early-stage start-ups to some of the largest, most established companies. Organizational core values include intellectual curiosity, personal accountability, and continuous improvement. We recognize that each person's potential depends on developing a dynamic and stimulating environment at every level.
We are a growing company and welcome you to be a contributing member of a great company. We are looking for talented individuals who are eager to make a high impact contribution towards our success as Assembly Technicians, Flip Chip Process Engineer and Process Development Engineer with hands on DOE experience.
To discuss exciting career opportunities with us, please write: email@example.com
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