Precision Package
Design for Tomorrow's Technology

Engineering custom, high-performance semiconductor and photonics packages—delivered “First Time Right” from prototype to full-scale production.

Get in touch

Precision Package Design for Tomorrow's Technology

Engineering custom,
high-performance semiconductor and photonics packages—delivered “First Time Right” from prototype to full-scale production.

Get in touch

Engineered Excellence in Semiconductor &
Photonics Package Design

Schematic and Layout

Schematics from datasheets or custom drawings, using industry-standard tools.
Substrate selection: build-up vs. HDI via feasibility studies.
Design and layout checked for rules and manufacturability before fab.

Signal Integrity

SI/PI analysis with 2.5D/3D solvers and SPICE modeling.
Time/frequency studies for crosstalk, impedance, and eye diagrams.
Meets JEDEC signal integrity standards.

Power Integrity

PDN checked for IR drop, AC impedance, and noise.
Simulates die, package, and PCB power impacts.
Design rules ensure reliable boards and substrates.

Build Up Boards

Supports fine line/space, laser vias, blind/buried vias.
Multiple finishes: ENIG, ENEPIG; all lead-free options.
Designed for high reliability in flip chip/wire bond BGA.

Ceramic Substrate

Custom designs for electrical and mechanical requirements.
Handles complex routing, thermal and placement constraints.
High-reliability for photonics, LiDAR, aerospace, and medical.

Advanced Assembly

100+ years' process expertise.
In-house tooling and automation for fast turnaround.
“Made in USA” for speed and IP protection.

Engineered Excellence in Semiconductor & Photonics Package Design

Schematic and Layout

Schematics from datasheets or custom drawings, using industry-standard tools.
Substrate selection: build-up vs. HDI via feasibility studies.
Design and layout checked for rules and manufacturability before fab.

Signal Integrity

SI/PI analysis with 2.5D/3D solvers and SPICE modeling.
Time/frequency studies for crosstalk, impedance, and eye diagrams.
Meets JEDEC signal integrity standards.

Power Integrity

PDN checked for IR drop, AC impedance, and noise.
Simulates die, package, and PCB power impacts.
Design rules ensure reliable boards and substrates.

Build Up Boards

Supports fine line/space, laser vias, blind/buried vias.
Multiple finishes: ENIG, ENEPIG; all lead-free options.
Designed for high reliability in flip chip/wire bond BGA.

Ceramic Substrate

Custom designs for electrical and mechanical requirements.
Handles complex routing, thermal and placement constraints.
High-reliability for photonics, LiDAR, aerospace, and medical.

Advanced Assembly

100+ years' process expertise.
In-house tooling and automation for fast turnaround.
“Made in USA” for speed and IP protection.

Innovative Package Design, Engineered for Excellence

At Silitronics, we push the boundaries of package design to empower the next generation of semiconductor and photonic systems. Leveraging decades of expertise, advanced automation, and a rigorous “First Time Right” methodology, our team partners with you from concept through volume manufacturing. Whether you require cutting-edge silicon photonics, multi-chiplet integration, or custom substrates, our solutions are tailored for performance, quality, and speed. Every package is meticulously designed and optimized to accelerate your roadmap—while our commitment to reliability ensures your products meet the highest standards across data center, AI/ML, LiDAR, IoT, medical, and defense applications.

SiP Design Process & Capabilities

Define Architecture

Substrate Technology Identification
Component & Material Selection
Signal Breakout & Fanout Strategies
Prelayout PDN Design
Thermal / Mechanical Plan

Design Input Parameters

IO planning based on chip, package and board co-design
Netlist Creation with Schematics / RTL / CSV etc
Design rules & constraint setup
IO + Placement Optimization

Package Layout

Physical design using Cadence SiP, APD and Allegro
Layer stack-up definition
Component & IO Placement, Routing
DFM & DFA Design Rules

Design Verification

SI : Eye width/height, BER, Return loss, crosstalk
PI : Target Z, IR drop, Ripple Noise analysis
Thermal : Hot spots, Die temperature
Mechanical: Warpage, Stress
HFSS, Power SI, ADS
DRC
BOM Availability

Release To Manufacturing

Design for Assembly (DFA)
Design for Manufacturing (DFM)
Reliability and Cost

SiP Design Capability

Define Architecture

Substrate Technology Identification
Component & Material Selection
Signal Breakout & Fanout Strategies
Prelayout PDN Design
Thermal / Mechanical Plan

Define Architecture

IO planning based on chip, package and board co-design
Netlist Creation with Schematics / RTL / CSV etc
Design rules & constraint setup
IO + Placement Optimization

Define Architecture

Physical design using Cadence SiP, APD and Allegro
Layer stack-up definition
Component & IO Placement, Routing
DFM & DFA Design Rules

Define Architecture

SI : Eye width/height, BER, Return loss, crosstalk
PI : Target Z, IR drop, Ripple Noise analysis
Thermal : Hot spots, Die temperature
Mechanical: Warpage, Stress
HFSS, Power SI, ADS
DRC
BOM Availability

Define Architecture

Design for Assembly (DFA)
Design for Manufacturing (DFM)
Reliability and Cost

Design Services Spectrum

Schematic and Layout

Using industry standard tools, Silitronics engineering team can create schematics from data sheets of merchant semiconductors or any custom drawing. We can do feasibility studies to select the best option between build up substrate or high density interconnect (HDI). After initial layout and SI/PI analysis, the design is reviewed to ensure design rules as well as DFM and DFA requirements are met before committing to FAB.

Signal Integrity

For applications requiring signal integrity (SI) and power integrity (PI) analysis, we work with the customer to understand their performance requirements. We use industry standard 2.5D and 3D field solvers to extract S-parameter model of the channel. Then, we fit the s-parameter model to a broadband spice model. Using this broadband SPICE channel model along with IBIS / IBIS-AMI models of the driver / receiver, we perform time / frequency domain analysis to study SI impairments such as crosstalk, impedance mismatch, and Eye diagrams. As an example, the figure on the right shows a simulated eye diagram of a LPDDR4X link connected to an ultra fine pitch SOC implemented on a SiP module with multilayer HDI stackup. As can be seen, the eye height and eye width meets the JEDEC mask specifications.

Power Integrity

To validate power integrity, we check PDN (Power distribution Network) DC IR drop, AC impedance and ripple noise. As an example, figure on the left shows a detailed multiport model of a SERDES PDN which includes die, package and PCB models. Simulated PDN impedance and time domain ripple noise is also shown for reference

Build Up Boards

All applications supported by Silitronics requires to understand cutting edge design rules and state-of-the-art processing technology. Flip Chip BGA and wire bond BGA substrates are semiconductor packages with high reliability requiring line/space of 15/15 (12/12 R&D), Fine pitch laser vias, blind and buried vias, surface finish (ENIG, ENEPIG, SOP, SAC 305) options with Halogen-free and Lead-free BOM.

Ceramic Substrate

We follow customer’s design, electrical and mechanical requirement of the product. In order to help with time to market, our team understand end application and special design requirements; such as, component size, placement, interference, impedance, circuit routing, thermal constraints, environmental constraints, etc. Silitronics has the knowledge, experience and resources to handle complicated design requirements in order to provide the best possible product. We are supplying high reliability substrates to the silicon photonics, LiDAR, aerospace, wireless, defense, industrial and medical applications. We can design the substrate by following customer’s net-list and schematic.

Advanced Assembly

Silitronics team has over 100+ years of hands-on process development experience. With “Just Do It” attitude, in-house tooling design & fabrication, alongwith fully in-house automated equipment, allows Silitronics team to work with customers to “Push the Limit” with “Made In USA”. That helps customer with faster time to market and IP Protection.

Design Rule