Build With The Best
The Silitronics team brings 100+ years of collective expertise in architecting designing, developing, and executing cost-effective, high-precision semiconductors and photonics packaging solutions—from initial concept to full-scale production.
Silitronics is a state-of-the-art, 20,000 sq ft automated ISO 9001 facility in San Jose, the heart of Silicon Valley, we ensure complicated process development including automated photonics active alignment, seamless scalability, and quality, consistently meeting the most demanding schedules and exceeding performance expectations.
Made in USA
Complete Turnkey Solutions
First Time Right
Prototype to Volume
Made in USA
Complete Turnkey Solutions
First Time Right
Prototype to Volume
Your Trusted One-Stop Partner For Advanced Semiconductors and Photonics Packaging
Our Solutions Spectrum
Early Packaging Architecture Exploration and Feasibility Analysis
With our advanced engineering and manufacturing expertise, we can engage with you at the earliest stages of product definition, review the product architecture together, with a path to volume production.
Comprehensive PRD
Development
Package architecture Review
Cost, yield, quality and Scalability Considerations
Rapid Prototyping and Turnkey Designs
We have in-house expertise to assist in all aspects of your product development, from rapid prototyping to turnkey solutions across many industries and applications.
Heterogeneous Integration
Silicon Photonics
MLO/mSAP/SLP/HDI
Test and Characterization boards
Embedded systems
Engineering Evaluation and Review for DFM, DFA & DFQ
Silitronics utilizes state of the art CAD tools to design next generation packaging and silicon photonics solutions. We specialize in Multiphysics analysis to ensure your products meet all of the SOW requirements and is optimized for first-pass success.
Zemax modeling
High-Speed Layout & Stack-up Optimization
SI/PI & Thermal Simulation
Chip-Package-PCB Co-Design
Substrate Design and Fabrication after DFM
We can fabricate build-up MLO substrates, mSAP/SLP, HDI boards, both, in house and through our extensive partner network for volume
Multi-layer Organic & Ceramic Substrate
Micro-via & Fine-Pitch Interconnect Processing
High speed low loss materials
Thin core
Embedded capacitors
Comprehensive IC + PIC Assembly capabilities
At Silitronics, we have decades of experience assembling complex packaging solutions.
1x24 FAU attachment
+/- 0.5um Active alignment
Flip-Chip & Wire Bonding
3D IC Stacking & SiP Integration
Custom Process Development for Complex IC + PIC Packaging
Silitronics specializes in developing custom semiconductor and photonic packaging processes tailored for multi-chiplet SiP, heterogeneous integration, and ultra-high-speed interconnects.
Sub-Micron Active Alignment
FAU Design & Selection
Co-packaged Optics (CPO)
Tested for Perfection, Engineered for Reliability
Reliability isn't an afterthought—it's engineered into every package at Silitronics. Our comprehensive testing protocols ensure that each semiconductor and photonic package meets performance, durability, and efficiency benchmarks before deployment.
Electrical Testing
Optical Validation
Thermal & Stress Testing
Mil Std 883 Rel Testing
Our Growing Impact: Customer Voices
Case Studies and Whitepapers
Driving Innovation in LiDAR with High-Precision SiP Packaging
Flawless execution, rapid prototyping, and first-pass success for cutting-edge automotive LiDAR technology.
Get In TouchAccelerating Innovation in 4K Live Streaming & Gaming Cameras
First-pass success, rapid prototyping, and precision execution for breakthrough imaging technology.
Get In TouchHigh-Yield, High-Precision IC Packaging for 5G & RF Innovation
Reliable, flexible, and high-performance IC packaging solutions, ensuring uninterrupted supply and exceptional quality.
Get In TouchBreaking the Bottleneck: Silicon Photonics and the Next Leap in High-Speed Data Transfer
How Silicon Photonics is revolutionizing AI clusters, HPC, and next-gen computing by overcoming electrical interconnect limitations.
Get In TouchHeterogeneous Integration: Unlocking Next-Gen Semiconductor Performance Beyond Moore's Law
How advanced packaging techniques like 2.5D, 3D IC, and Chiplet integration are driving the semiconductor industry forward.
Get In TouchSustainable Semiconductor Packaging: Reducing Power, Heat, and Waste in Next-Gen Electronics
How eco-friendly materials, energy-efficient designs, and advanced photonics are driving sustainability in semiconductor manufacturing.
Get In TouchGet in touch
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