Assembly services overview
Flip Chip & Wire
Bond Assembly
Advanced flip chip and wire bond support for BGAs and SiPs, ensuring optimal electrical, thermal, and mechanical performance.
Automated AOI &
Electrical/Optical Testing
Comprehensive on-line inspection and functional validation for every build stage.
Multi-Chip
Module Build
Customized SiP assembly with multiple die integration, enhanced traceability, and robust underfill for reliability.
Custom Tooling &
Process Development
Bespoke process and automation for unique devices, delivering fast, reliable launches.
Fabrication services overview
Flip Chip & Wire Bond Assembly
Advanced flip chip and wire bond support for BGAs and SiPs, ensuring optimal electrical, thermal, and mechanical performance.
Automated AOI & Electrical/Optical Testing
Comprehensive on-line inspection and functional validation for every build stage.
Multi-Chip Module Build
Customized SiP assembly with multiple die integration, enhanced traceability, and robust underfill for reliability.
Custom Tooling & Process Development
Bespoke process and automation for unique devices, delivering fast, reliable launches.
Ultimate Reliability, Perfected—
Micron-Level Assembly Excellence
Assembly Process Overview
Die Attach & Precision Placement
Custom pick-and-place systems deliver ±0.5µm accuracy, supporting single die, chiplet, or multi-chip module builds. Continuous monitoring and humidity/ESD controls ensure zero misalignment, ideal for photonics, medical, and defense platforms.
Flip-Chip Bumping & Wire Bonding
Solder and gold bumping scales to 19,000+ connections per device, supporting fine pitch and high IO. Wire bonding complements flip-chip for hybrid modules, each process optimized for thermal stress, electrical SI/PI, and mechanical reliability.
Multi-Chip SiP Module Build & Traceability
Silitronics’ expertise integrates up to nine dies in a single system-in-package, utilizing robust underfill, real-time AOI, and full documentation tracking—guaranteeing every module’s pedigree and functional integrity.
Final Assembly, Encapsulation & Test
Overmolding, lidding, and comprehensive electrical/optical test wrap up the process, ensuring every device meets stringent specs for field deployment under varied conditions.
Our Services Spectrum
Die Attach & Precision Placement
Custom pick-and-place systems deliver ±0.5µm accuracy, supporting single die, chiplet, or multi-chip module builds. Continuous monitoring and humidity/ESD controls ensure zero misalignment, ideal for photonics, medical, and defense platforms.
Flip-Chip Bumping & Wire Bonding
Solder and gold bumping scales to 19,000+ connections per device, supporting fine pitch and high IO. Wire bonding complements flip-chip for hybrid modules, each process optimized for thermal stress, electrical SI/PI, and mechanical reliability.
Multi-Chip SiP Module Build & Traceability
Silitronics’ expertise integrates up to nine dies in a single system-in-package, utilizing robust underfill, real-time AOI, and full documentation tracking—guaranteeing every module’s pedigree and functional integrity.
Final Assembly, Encapsulation & Test
Overmolding, lidding, and comprehensive electrical/optical test wrap up the process, ensuring every device meets stringent specs for field deployment under varied conditions.
Assembly Services Spectrum
Flip Chip and Wire Bond
Assembly Services
Full support for BGA, SiP, and hybrid modules—Silitronics offers both leading-edge and legacy techniques to maximize performance, reliability, and flexibility.
Advanced Multi-Chip
Module Build
Layered integration, custom underfill, and robust traceability protocols for system-level packages—including automated defect isolation and yield optimization.
Automated AOI &
Electrical/Optical Testing
Integrated inspection from placement through final test—no defect unnoticed. Electrical/optical checks support both performance and reliability standards.
Custom Tooling & Process
Development Solutions
Bespoke automation and process flows, crafted to each customer’s requirements. Silitronics leverages its 100+ years of team knowledge to overcome any challenge.
Assembly Services Spectrum
Flip Chip and Wire Bond Assembly Services
Full support for BGA, SiP, and hybrid modules—Silitronics offers both leading-edge and legacy techniques to maximize performance, reliability, and flexibility.
Advanced Multi-Chip Module Build
Layered integration, custom underfill, and robust traceability protocols for system-level packages—including automated defect isolation and yield optimization.
Dicing
Automated AOI & Electrical/Optical Testing
Integrated inspection from placement through final test—no defect unnoticed. Electrical/optical checks support both performance and reliability standards.
Custom Tooling & Process Development Solutions
Bespoke automation and process flows, crafted to each customer’s requirements. Silitronics leverages its 100+ years of team knowledge to overcome any challenge.
Rapid Prototyping & Volume Manufacturing
Silitronics offers agile prototyping—delivering functional substrates fast—alongside robust volume manufacturing, maintaining process repeatability, high yield, and rigorous documentation from the first sample to full-scale deployment.
Our Services Spectrum
Precision-Driven Design for
Next-Gen Semiconductor &
Photonic Packaging
From concept to layout, our advanced design expertise ensures seamless integration of chips, substrates, and interconnects. We optimize signal integrity, power efficiency, and thermal performance to meet the demands of AI accelerators, quantum computing, and high-speed photonic systems. With deep engineering insights, we design scalable, high-reliability solutions for the future.
LEARN MORE
Fabrication for Advanced
Semiconductor & Photonic Packaging
Our state-of-the-art fabrication facility delivers high-precision multi-layer substrates tailored for AI, HPC, and Silicon Photonics. With expertise in organic and ceramic substrates, fine-pitch interconnects, and high-density integration, we ensure superior reliability, scalability, and manufacturing excellence. From prototypes to high-volume production, we bring innovation to life with precision.
LEARN MORE
High-Precision Wafer Dicing
We deliver advanced wafer dicing using precision blade and laser technologies to ensure clean die separation with minimal chipping. Optimized for high yield and low particle contamination, our dicing supports next-gen semiconductor packaging and performance.
LEARN MORE
Powering the Future at the
Speed of Light with Photonics
Silicon Photonics is transforming high-speed computing, AI clusters, and next-gen data transfer. Our expertise in sub-micron active alignment, optical integration, and high-bandwidth packaging ensures low-latency, energy-efficient performance. From LiDAR to AI-driven interconnects, we deliver cutting-edge photonics solutions that push the limits of speed, scalability, and efficiency.
LEARN MORE
Seamless Assembly for High-Precision
Semiconductor & Photonic Packaging
Our cutting-edge assembly expertise ensures precise chip-to-package integration with industry-leading sub-micron active alignment, high-density interconnects, and heterogeneous integration. We specialize in complex optical and electronic assemblies for AI accelerators, 5G networks, and next-gen computing, delivering high-reliability solutions that optimize performance and reduce time to market.
LEARN MORE
Breakthrough Chiplet Integration for
Scalable, Next-Gen Systems
Silitronics empowers the future of electronics with advanced chiplet integration—merging diverse dies on precision-engineered interposers for optimal signal, power, and thermal performance. Our expertise in modular floor planning and heterogeneous assembly accelerates high-bandwidth, low-latency connectivity that’s essential for AI, HPC, and 5G. From concept design to rigorous validation, Silitronics helps customers bring complex systems to market—faster, smarter, and more reliably.
LEARN MOREOur Services Spectrum
Precision-Driven Design for
Next-Gen Semiconductor
& Photonic
Packaging
From concept to layout, our advanced design expertise ensures seamless integration of chips, substrates, and interconnects. We optimize signal integrity, power efficiency, and thermal performance to meet the demands of AI accelerators, quantum computing, and high-speed photonic systems. With deep engineering insights, we design scalable, high-reliability solutions for the future.
LEARN MOREFabrication for AdvancedSemiconductor & Photonic Packaging
Our state-of-the-art fabrication facility delivers high-precision multi-layer substrates tailored for AI, HPC, and Silicon Photonics. With expertise in organic and ceramic substrates, fine-pitch interconnects, and high-density integration, we ensure superior reliability, scalability, and manufacturing excellence. From prototypes to high-volume production, we bring innovation to life with precision.
LEARN MOREHigh-Precision Wafer Dicing
We deliver advanced wafer dicing using precision blade and laser technologies to ensure clean die separation with minimal chipping. Optimized for high yield and low particle contamination, our dicing supports next-gen semiconductor packaging and performance.
LEARN MOREPowering the Future at the Speed of Light with Photonics
Silicon Photonics is transforming high-speed computing, AI clusters, and next-gen data transfer. Our expertise in sub-micron active alignment, optical integration, and high-bandwidth packaging ensures low-latency, energy-efficient performance. From LiDAR to AI-driven interconnects, we deliver cutting-edge photonics solutions that push the limits of speed, scalability, and efficiency.
LEARN MORESeamless Assembly for High-Precision Semiconductor & Photonic Packaging
Our cutting-edge assembly expertise ensures precise chip-to-package integration with industry-leading sub-micron active alignment, high-density interconnects, and heterogeneous integration. We specialize in complex optical and electronic assemblies for AI accelerators, 5G networks, and next-gen computing, delivering high-reliability solutions that optimize performance and reduce time to market.
LEARN MOREBreakthrough Chiplet Integration for Scalable, Next-Gen Systems
Silitronics empowers the future of electronics with advanced chiplet integration—merging diverse dies on precision-engineered interposers for optimal signal, power, and thermal performance. Our expertise in modular floor planning and heterogeneous assembly accelerates high-bandwidth, low-latency connectivity that’s essential for AI, HPC, and 5G. From concept design to rigorous validation, Silitronics helps customers bring complex systems to market—faster, smarter, and more reliably.
LEARN MORECase Studies
Flawless execution, rapid prototyping, and first-pass success for cutting-edge automotive LiDAR technology.
Flawless execution, rapid prototyping, and first-pass success for cutting-edge automotive LiDAR technology.
Download case studyAccelerating Innovation in 4K Live Streaming & Gaming Cameras
First-pass success, rapid prototyping, and precision execution for breakthrough imaging technology.
Download case studyHigh-Yield, High-Precision IC Packaging for 5G & RF Innovation
Reliable, flexible, and high-performance IC packaging solutions, ensuring uninterrupted supply and exceptional quality.
Download case studyGet in touch
Interested in our end-to-end advanced semiconductor and photonics (PIC) packaging solutions?
Share your details for an expert connect.
