Each substrate starts with careful material selection—BT, ABF, or ceramic bases tailored for electrical, thermal, and mechanical needs. Sophisticated lamination controls produce uniform core thickness and optimal dielectric properties, forming the foundation for reliable, high-density interconnects in complex stack-ups.

Utilizing both mechanical and precision laser drilling, Silitronics produces microvias at sub-15µm sizes for dense layouts. Advanced laser techniques allow formation of blind/buried vias in multilayer boards, critical for HDI and next-gen designs. Every drill cycle is monitored for registration and via integrity to prevent signal loss.

Dry film lamination and photolithography precisely create circuit features down to 10/10 µm. High-quality copper plating ensures controlled impedance and robust signal performance, while state-of-the-art etching selectively removes unwanted metal. The result is consistently accurate trace geometry in every substrate.

Silitronics engineers ceramic substrates using tape lamination, screen printing, and high-temperature sintering. These processes enable reliable thick film metallization and precise conductor patterns for harsh environment and RF applications. Meticulous polishing delivers perfect surface finishes vital for photonics and sensing platforms.

Substrates receive premium finishes including ENIG, ENEPIG and OSP, supporting solderability and corrosion resistance. Automated Optical Inspection (AOI) and electrical testing rigorously validate layer registration and circuit continuity, guaranteeing process reliability and readiness for advanced assembly.

Each substrate is precisely profiled and cut to custom dimensions, undergoes final inspection, and receives full process documentation to aid traceability and support regulatory requirements. This end-to-end approach eliminates hidden defects and assures high-yield downstream integration.