“A” Team with 100+ Years of
Design and Assembly Experience

Dhiraj is leading Sales, Marketing and Strategic Growth of Silitronics. Dhiraj has an excellent mix of engineering and sales experience. During the first 10 years of his career, he did package design and assembly process development at Nortel Networks, Lucent Technology, JDSU and start-ups in MEMS, Optical Switch and SiP Modules. Before Silitronics, he was Senior Director of Sales at ASE (#1 OSAT in the World) where Dhiraj grew his accounts from $50M/year to over $200M/year. He led a Joint Venture of $75M in WLCSP for 12” Wafer and successfully ramped a SiP sensor over 20M/year. Dhiraj grew an account from $0 to $84M/year and increased market share with multiple accounts in the north of 70%. Dhiraj graduated from the University of Ottawa with Summa Cum Laude, Deans’ Honor List, Ranking 1st in the class and won many scholarships. Outside of work, Dhiraj has diverse interests in sports (NFL - 49ers, NBA - Warriors, NHL- Senators and Cricket), the stock market, as a volunteer soccer coach and plays golf.

Dr. Pathak is leading Strategic Development and expanding Silitronics’ capabilities in complex System in Package ( SiP) Design and modeling for high speed, AI/ML, LiDAR, Silicon Photonics and IoT applications. Vijay is a Semiconductor industry veteran with over 35 years of design and product development experience in various companies across the globe. Prior to Silitronics, he was the Distinguished Member at Texas Instruments, CTO of Megachips Technology America and CTO of Sankalp Semiconductor. Vijay held positions from Design Engineer to Executive Management in Europe, USA and India to be responsible for technology development and product execution for consumer and telecom applications. He holds 9 patents and 5 publications in reputed journals in the field of power semiconductors, high speed interfaces and analog circuits. Vijay did his Ph.D. from Bristol University, UK. Outside of work, Vijay has diverse interests ranging from study of Upanishad, Yoga/meditation, gardening, running, travelling and Golf.

Terrance is leading Operation and Supply Chain at Silitronics. He has over 25 years of experience in productivity, cost control and on- time delivery while at Ikanos Communications (Qualcom), SST, Cypress and eASIC (Intel). Before joining Silitronics, Terrance was Director of Supply Chain and Planning at GigOptix which was acquired by IDT/Renesas. Terrance has successfully managed over $100M in yearly spend on Wafer, Assembly, Test and PCBA while negotiating the best pricing, cycle time and capacity. Outside of work, Terrance is very proud of his Steelers, the winner of the Most Super Bowls till Patriots joined them in 2019 and coach of his daughter’s softball team.

Fredrick is the lead for Quality at Silitronics. He has over 26 years of experience in BGA, Flip Chip, Wire Bonding, SiP assembly and R&D engineering while at IPAC, OSE, Pantronix, i2a Technologies and AiPAC. Before joining Silitronics, Fredrick was Director of Operations and Quality at Meritronics. Fredrick is a certified Lead ISO Auditor and FMEA. He did his BSME from the University of Gothenburg, Sweden and MS from San Jose State. In his spare time, Frederick likes to explore local trails and hiking.

Emir is leading Automatic Assembly Process Development as well as Tooling Design and Fabrication to devise the best Flip Chip and Wire Bonding at Silitronics. Alongwith Silitronics team, Emir successfully implemented Auto Pick and Place with +/- 3um, 3674 wires per SiP modules along with multiple assembly processes for LiDAR, Silicon Photonics, AR/VR and Quantum Computing. Before joining Silitronics, Emir did MEMS assembly and Substrate Fabrication @ Dunan. Emir did tooling design and optimization to support Capital Equipment while at Applied Material. Emir is a graduate of San Jose State. Outside of work, Emir loves to play with his dog, gardening and fix his cars from ground up.

Sri is leading Engineering Assembly and NPI ramp up at Silironics. He brings more than 25 years of handson experience in IC Assembly, Flip Chip, Bumping and space level Chip on Board assembly. Sri will be one of the catalysts for Silitronics 2.0 growth in RF, AI/ML, LiDAR, Silicon Photonics, Medical and Chiplets Integration. Prior to joining Silitronics, Sri worked at Lucent Technologies, Honeywell, Skyworks and Mercury Defense Systems. At Skyworks, Sri led and contributed significantly to qualify first with US Based Bump Supplier and then near shore ramping up of WLCSP packages in multi-millions per year. At his most recent position, Sri oversaw yearly revenue growth from $30M to $100M with high yield, on time delivery and the best quality. Sri's initial focus will be on process development optimization and outgoing engineering quality. Sri has M.S. in Mechanical Engineering with specialization in Electronic Packaging from Florida State University. Sri has taken Course Work in Management at Georgia Tech. In his spare time, Sri loves to go for long hikes.