Over 100+ years of hands-on experience to contribute value add inputs during initial discussion of product design, performance, form factor and pricing roadmaps

Silitronics engineering team have over 100+ years of hands-on experience to contribute value add inputs during initial discussion of product design, performance, form factory and pricing roadmaps. A few selected Customer Projects successfully developed by Silitronics Team:
Engineering inputs on design of complicated build up substrate for 4 flip chip ICs, 1 Interposer, 4 wire bond ICs, over 1000 wires per SiP modules and Thermocompression Flip Chips, Cloud Application
Complicated Automatic Pick and Place with +/- 5.0um accuracy and 3600 wire bonds per SiP Module for Quantum Computing Application
Design and Fabrication of 4-2-4 Build Up Flip Chip package, Automatic Ball Attach, PCBA including FCBGA package for FinTech Application
Assembly process modification and optimization of ICs with Optics, Silicon Siffner to maximize flaness, 470 wires, Test before and after assembly for LiDAR Application
Tx and Rx Modules including +/-3um placement, controlled Pitch, Yaw and Roll, 3mil loop height, mix of Ribbon and Wedge Bonding for Silicon Photonics Application
MMIC RF and COB assembly optimizations for placement, BOM and Thermal Hierarchy for 5G, Defense and Space Application
Multi Chip Modules (MCM) on Long Flex Assembly on very tight space for Medical Applications

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