The chip integration with Silicon Interposer is in its initial stage as customers want to have flexibility to select chips with different packages. The main advantages are to save on cost, size, power and cycle time without sacrificing performance and quality. Contact Silitronics team to discuss your specific applications.
SiP carrier substrate provides a platform for multiple chips or packages or passive components assembly. The applications include Multi-Chip Module (MCM), Multi-Chip Package (MCP), Stack Die, Package in Package (PiP) and Embedded Substrates. SiP integrates inhomogeneous ICs and other components with compact profile and faster time-to-market.