Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications.

  • Complex MMIC + PCBA + Flip Chip
  • DOEs to optimize different epoxies for <1% void for Space Application
  • Mix of gold Wedge and Ribbon bonding to optimize electrical performance
  • 100um and 50um thin die with air bridge, design and fabricated special collet
  • Optimize dispensing pattern and amount for 50um thin die
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