Assemblyand Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications


Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop, and implement cost effective packaging solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in Santa Clara, the heart of Silicon Valley, and boasts a 10,000+ sq.ft. state of art automated facility with 10K and 1K clean rooms.

Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. In house Machine Shop for fast cycle time.

Typical Cycle Time

Examples of Selected SiP Assemblies

1K and 10K Clean Rooms

Automatic Bonding, AR/VR,
60um Pitch, 140 Wires

Auto Wedge Bonding, Silicon Photonics,
50um Pitch, 292 wires

Auto Ball Bonding, IoT Sensor,
75um Loop Ht

Your One-Stop Partner for
Advanced Semiconductor IC Packaging

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