Assembly and Design Solutions for Silicon Photonics, LiDAR, SiP, MCM Modules, IoT Sensors, Medical, Telecom, 5G RF and Commercial Applications

Facility

Silitronics provides industry leading semiconductor IC package design and assembly services guided by “First Time Right” philosophy. The Silitronics team has 100+ years of collective experience and expertise to propose, develop, and implement cost effective packaging solutions from concepts to finished products while meeting schedules and exceeding specifications. Silitronics is centrally located in San Jose, the heart of Silicon Valley, and boasts a 10,000+ sq.ft. state of art automated facility with 10K and 1K clean rooms.

Silitronics’ has fully automated equipment: Flip Chip with +/- 0.5um placement, Auto Dispensing and Pick/Place within +/- 3um accuracy, Automatic Wire Bonders for tight pitch of 45um, 200um wire length and 50um loop height, Automatic Eutectic and Hermetic Sealing, SMT Line for PCBA, 3-D Laser Microscope, Die Shear, X-ray and Wire Pull Tester for Quality Control. In house Machine Shop for fast cycle time.

Typical Cycle Time

Examples of Selected SiP Assemblies

1K and 10K Clean Rooms

Automatic Assembly Equipment On Site

Automatic Dispensing + Pick And Place
Automatic Dispensing + Pick And Place
Fully Automatic Die Attach System upto +/- 5um
Fully Automatic Die Attach System upto +/- 5um
Solder Paste and Gold Printing
Solder Paste and Gold Printing
Auto Gold Stud Bonder
Auto Gold Stud Bonder
Automatic Fine Pitch Wedge Wire Bonding 20um Gold
Automatic Fine Pitch Wedge Wire Bonding 20um Gold
N2 Plasma Clean
N2 Plasma Clean for 100% Die Attach and Wire Bonding
Auto Epoxy Dispenser
Auto Epoxy Dispenser
Auto Wedge Wire Bonder
Auto Wedge Wire Bonder
Keyence Laser 3D Microscope
Laser 3D Microscope
Keyence Laser 3D Microscope
Auto Wire Pull Tester and Die Shear
Keyence Laser 3D Microscope
Hermetic Sealing + Eutectic Reflow
Keyence Laser 3D Microscope
Auto Plasma-Clean System
Wire Bonding Ball Fine Pitch
Wire Bonding Ball Fine Pitch
 Wire Bonding Wedge Low Loop
Wire Bonding Wedge Low Loop
Xyztech Auto Die Shear + Wire Pull Condor Sigma
Auto Die Shear + Wire Pull upto 100N

Automatic Bonding, AR/VR,
60um Pitch, 140 Wires

Auto Wedge Bonding, Silicon Photonics,
50um Pitch, 292 wires

Auto Ball Bonding, IoT Sensor,
75um Loop Ht


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