"When the success of your company is based on a very critical execution of every piece, where everything must work the first time, you need to have a partner like Silitronics who you can be confident that they will perform.
We make a clear distinction between a vendor/supplier and a partner. Only a partner, like Silitronics, is invested in your success "
- Leading Digital 4K Imaging Customer
Silitronics works closely with customers to understand their product requirements, suggest alternatives in package/SiP design or optimize process development or suitable assembly flow for the application. Typical engagements will cover following areas:
Starting with netlist and product specifications, develop 2.5D and 3D SiP solutions for Chiplet Integration and New Product Introduction
Optimize package selection for the best performance, price and schedule. Evaluate Test and Reliability Plan to optimize BOM
Package substrate layout followed by in depth SI, PI and Thermal/Mechanical analysis. Design for Assembly analysis to ensure high yield, quality and competitive pricing
Silitronics is equipped with state of the art Assembly Equipment enabling packaging for many end applications