Silitronics offers value added package design and assembly services from concept to NPI to high volume production. We are committed to help our customers with their entire package development as a turnkey project or assist in any of the design stages such as netlist creation, layout, SI/PI and thermal analysis including fabrication of the build up multi-layer HDI and Ceramic boards.

One of our key differentiated services is assembly process development. Many of the NPI package assemblies which Silitronics does are so advanced that there is no precedence and does not fit in a standard assembly template. Often the design rules have to be pushed beyond their limits. This requires development of test vehicles, identification of right material sets, careful process control, monitoring of assembly parameters through well crafted Design of Experiments (DOE) and even investments in new equipment. Silitronics has 100+ man years of R&D experience, in this assembly process development, to take NPI packages to high volume production.